SMART Modular has unveiled a new lineup of 32 GB Mini-DIMMs for extreme environments, such as industrial or telecommunication applications. The new high-density modules come in ULP (Ultra Low Profile) as well as VLP (Very Low Profile) heights and are rated for speeds up to DDR4-3200. SMART’s DDR4-3200 32 GB Mini-DIMMs are based on 16 Gb memory chips (from an unknown supplier) and utilize a custom-designed PCB with conformal coating and anti-sulfur resistors, which is designed to protect against toxic environments as well as vibration. Depending on the target application, SMART provides the high-density 32 GB Mini-DIMMs with unbuffered or registered ECC options. The manufacturer offers its industrial 32 GB Mini-DIMMs in ULP height (17.78 mm) and VLP height (18.75 mm). Mini-DIMMs are JEDEC-standard modules with...
SMART Modular this month demonstrated one of the industry’s first prototypes of a EDSFF 3-inch DDR4 Gen-Z memory module. The ZMM supports advanced functionality enabled by the new interface...15 by Anton Shilov on 8/15/2019
SMART Modular has introduced the industry’s first industrial-grade 32 GB DDR4 SO-DIMMs. The memory modules are aimed at ruggedized computing applications that require top-of-the-line capacity modules with improved reliability.2 by Anton Shilov on 5/9/2019
SMART Modular has introduced one of the industry’s first ruggedized SSDs based on 3D TLC NAND memory. Aimed at industrial and military customers, the high-reliability 2.5-inch SATA drive incorporates...4 by Anton Shilov on 5/8/2019