One of the interesting disclosures here at the IEEE International Electron Devices Meeting (IEDM) has been around new and upcoming process node technologies. Almost every session so far this week has covered 7nm, 5nm, and 3nm processes (as the industry calls them). What we didn’t expect to see disclosed was an extended roadmap of Intel’s upcoming manufacturing processes.
Intel’s ‘Tick-Tock’ Seemingly Dead, Becomes ‘Process-Architecture-Optimization’
As reported at The Motley Fool, Intel’s latest 10-K / annual report filing would seem to suggest that the ‘Tick-Tock’ strategy of introducing a new lithographic process note in...98 by Ian Cutress on 3/22/2016