It took the semiconductor industry over a decade to prep everything needed for production of chips using extreme ultraviolet (EUV) lithography. It looks like it is going to take a lot less to reach the next level — EUV with High-NA. Higher Resolution Needed Nowadays the most advanced chips are made on 5/4-nm-class process using EUV lithography ASML's Twinscan NXE:3400C (and similar) systems that feature a 0.33 numerical aperture (NA) optics, which provides a 13 nm resolution. This resolution is good enough for a single-pattern approach at 7 nm/6 nm nodes with 36 nm ~ 38 nm pitches and at 5nm with 30 nm ~ 32 nm pitches. But as pitches get below 30 nm (at beyond 5 nm nodes) the 13 nm resolution might call...
Intel for the last few years has been undergoing a major period of manufacturing expansion for the company. While the more recent announcements of new facilities in Ohio and...91 by Ryan Smith on 4/11/2022
It’s somewhat of an understatement to say that Intel’s future roadmap on its process node development is one of the most aggressive in the history of semiconductor design. The...16 by Dr. Ian Cutress on 2/18/2022
With fab expansions on tap across the entire semiconductor industry, Intel today is laying out their own plans for significantly increasing their production capacity by announcing their intention to...114 by Ryan Smith on 1/21/2022
One of the overriding key themes of Pat Gelsinger’s ten-month tenure at Intel has been the eponymous will to ‘bring geek back’ to the company, implying a return to...49 by Dr. Ian Cutress on 10/29/2021
Over the last couple of years, a great deal of concern has developed around the future of semiconductor manufacturing, both with respect to total capacity and where the next...19 by Ryan Smith on 8/23/2021
In today’s Intel Accelerated event, the company is driving a stake into the ground regarding where it wants to be by 2025. CEO Pat Gelsinger earlier this year stated...326 by Dr. Ian Cutress on 7/26/2021