Dozens of Companies Adopt TSMC's 3nm Process Technology
Designing chips for modern, leading-edge manufacturing technologies is an expensive endeavor. Still, dozens of companies have already adopted TSMCs N3 and N3E (3 nm-class) fabrication processes, according to disclosures...
9 by Anton Shilov on 7/28/2023
Samsung Begins to Produce Third 3nm Chip Amid Massive Losses On DRAM & NAND
Samsung this week reported their financial results for the second quarter of 2023, closing the book on an especially bleak quarter of the year with a massive $3.4 billion...
14 by Anton Shilov on 7/28/2023
Seagate Ships First Commercial HAMR Hard Drives
Seagate announced this week that it had begun the first commercial revenue shipments of its next-generation HAMR hard drives, which are being shipped out as part of Seagate's latest...
3 by Anton Shilov on 7/28/2023
Micron Publishes Updated DRAM Roadmap: 32 Gb DDR5 DRAMs, GDDR7, HBMNext
In addition to unveiling its first HBM3 memory products yesterday, Micron also published a fresh DRAM roadmap for its AI customers for the coming years. Being one of the...
4 by Anton Shilov on 7/27/2023
Rapidus Wants to Supply 2nm Chips to Tech Giants, Challenge TSMC
It has been a couple of decades since a Japanese fab has offered a leading-edge chip manufacturing process. Even to this day, none of the Japanese chipmakers have made...
19 by Anton Shilov on 7/26/2023
Micron Unveils HBM3 Gen2 Memory: 1.2 TB/sec Memory Stacks For HPC and AI Processors
Micron today is introducing its first HBM3 memory products, becoming the latest of the major memory manufacturers to start building the high bandwidth memory that's widely used in server-grade...
7 by Anton Shilov on 7/26/2023
TACC's Stampede3 Supercomputer Uses Intel's Xeon Max with HBM2E and Ponte Vecchio
The Texas Advanced Computing Center (TACC) unveiled its latest Stampede supercomputer for open science research projects, Stampede3. TACC anticipates that Stampede3 will come online this fall and will deliver...
5 by Anton Shilov on 7/25/2023
Crucial X9 Pro and X10 Pro High-Performance Portable SSDs Announced
Crucial's X6 and X8 Portable SSDs have been attractive budget options for the mainstream consumers looking to purchase high-capacity direct-attached storage drives. The company has been delivering some industry-firsts...
8 by Ganesh T S on 7/25/2023
TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging
TSMC on Tuesday announced plans to construct a new advanced chip packaging facility in Tongluo Science Park. The company intends to spend around $2.87 billion on the fab that...
3 by Anton Shilov on 7/25/2023
Cadence Buys Memory and SerDes PHY Assets from Rambus
In a surprising turn of events, Cadence and Rambus entered into a definitive agreement late last week for Cadence to buy memory physical interface IP and SerDes businesses from...
5 by Anton Shilov on 7/24/2023
AMD Launches Ryzen 5 7500F in China: Zen 4 With no Integrated Graphics
Over the weekend, AMD officially listed the Ryzen 5 7500F processor on their website. Although initial reports pointed towards a China-only release, and at present, that much is true...
9 by Gavin Bonshor on 7/24/2023
TSMC: 3nm Chips for Smartphones and HPCs Coming This Year
While TSMC formally started mass production of chips on its N3 (3nm-class) process technology late last year, the company is set to finally ship the first revenue wafers in...
21 by Anton Shilov on 7/21/2023
Ultra Ethernet Consortium Formed, Plans to Adapt Ethernet for AI and HPC Needs
This week the Linux Foundation has announced that the group will be overseeing the formation of a new Ethernet consortium, with a focus on adapting and refining the technology...
7 by Anton Shilov on 7/21/2023
Cerebras to Enable 'Condor Galaxy' Network of AI Supercomputers: 36 ExaFLOPS for AI
Cerebras Systems and G42, a tech holding group, have unveiled their Condor Galaxy project, a network of nine interlinked supercomputers for AI model training with aggregated performance of 36...
1 by Anton Shilov on 7/21/2023
Solidigm Announces D5-P5336: 64 TB-Class Data Center SSD Sets NVMe Capacity Records
Advancements in flash technology have come as a boon to data centers. Increasing layer counts coupled with better vendor confidence in triple-level (TLC) and quad-level cells (QLC) have contributed...
18 by Ganesh T S on 7/20/2023
TSMC Delays Arizona Fab Deployment to 2025, Citing Shortage of Skilled Workers
TSMC on Thursday disclosed that it will have to delay mass production at its Fab 21 in Arizona to 2025, as a lack of suitably skilled workers is slowing...
27 by Anton Shilov on 7/20/2023
ASUS Signs Agreement to Continue Development and Support of Intel's NUC Business
ASUS and Intel late on Tuesday announced that they had agreed to a term sheet involving Intel's NUC business, ensuring the continued support of existing NUC hardware as well...
6 by Ganesh T S & Anton Shilov on 7/19/2023
Samsung Completes Initial GDDR7 Development: First Parts to Reach Up to 32Gbps/pin
Samsung has announced this evening that they have completed development on their first generation of GDDR7 memory. The next iteration of the high bandwidth memory technology, which has been...
11 by Ryan Smith on 7/18/2023
Logitech Acquires Loupedeck to Enhance Its Software Roadmap
Being a significant maker of peripherals in general and gaming peripherals in particular, Logitech cannot omit the content creators and streamers market, which is now virtually dominated by Corsair's...
6 by Anton Shilov on 7/18/2023
Samsung Shipping First GAAFET Silicon; 3nm and 4nm Yields Are Improving - Report
Currently, only two foundries offer their customers 3 nm and 4 nm-class process technologies: TSMC and Samsung Foundry. But business media sometimes blames Samsung Foundry for mediocre yields on...
5 by Anton Shilov on 7/18/2023
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