Semiconductors
Optical connectivity – and especially silicon photonics – is expected to become a crucial technology to enable connectivity for next-generation datacenters, particularly those designed HPC applications. With ever-increasing bandwidth requirements needed to keep up with (and keep scaling out) system performance, copper signaling alone won't be enough to keep up. To that end, several companies are developing silicon photonics solutions, including fab providers like TSMC, who this week outlined its 3D Optical Engine roadmap as part of its 2024 North American Technology Symposium, laying out its plan to bring up to 12.8 Tbps optical connectivity to TSMC-fabbed processors. TSMC's Compact Universal Photonic Engine (COUPE) stacks an electronics integrated circuit on photonic integrated circuit (EIC-on-PIC) using the company's SoIC-X packaging technology. The foundry says that usage...
TSMC Forms 3DFabric Alliance to Accelerate Development of 2.5D & 3D Chiplet Products
Currently the majority of high-end processors are monolithic, but design methodologies are slowly but surely shifting to multi-chiplet modules as leading-edge fabrication technologies get more expensive to use. In...
9 by Anton Shilov on 10/27/2022
Micron Announces 20-Year Plan To Build $100 Billion U.S. Fab Complex
Now that the U.S. government has finally settled the matter of whether it would be providing subsidies to entice chip fabs to setup shop within the U.S., those fabs...
48 by Anton Shilov on 10/10/2022
Samsung Foundry Outlines Roadmap Through 2027: 1.4 nm Node, 3x More Capacity
Samsung outlined its foundry business roadmap for the next five years at its Foundry Forum event last week. The company plans to introduce its next generation fabrication technologies in...
14 by Anton Shilov on 10/10/2022
Micron Breaks Ground on Its $15 Billion EUV DRAM Fab in the U.S.
Micron this week broke ground on its leading-edge memory production facility near Boise, Idaho. The company will invest $15 billion in its new fab as a part of its...
23 by Anton Shilov on 9/14/2022
SK Hynix Starts Prepping for Next Semiconductor Boom with $11 Billion Memory Fab
When a major South Korean memory firm invests over $11 billion in a fab, that raises a couple of eyebrows. But when it comes within a major $100+ billion...
7 by Anton Shilov on 9/8/2022
Intel Kicks Off Fab Co-Investment Program with Brookfield: New Fabs to be Jointly Owned
Intel this week introduced its new Semiconductor Co-Investment Program (SCIP) under which it will build new manufacturing facilities in collaboration with investment partners – a sharp departure from the...
28 by Anton Shilov on 8/24/2022
Samsung's $15 Billion R&D Complex to Overcome Limits of Semiconductor Scaling
Samsung on Friday broke ground for a new semiconductor research and development complex which will design new fabrication processes for memory and logic, as well as conduct fundamental research...
26 by Anton Shilov on 8/19/2022
TSMC and ASML: Demand for Chips Remains Strong, But Getting Fab Tools Is Hard
TSMC's revenue this year is going to set an all-time record for the company, thanks to high demand for chips as well as increased prices that its customers are...
13 by Anton Shilov on 7/21/2022
Samsung Starts 3nm Production: The Gate-All-Around (GAAFET) Era Begins
Capping off a multi-year development process, Samsung’s foundry group sends word this morning that the company has officially kicked off production on its initial 3nm chip production line. Samsung’s...
22 by Ryan Smith on 6/30/2022
TSMC: N2 To Start With Just GAAFETs, Add Backside Power Delivery Later
When TSMC initially introduced its N2 (2 nm class) process technology earlier this month, the company outlined how the new node would be built on the back of two...
16 by Anton Shilov on 6/29/2022
TSMC to Customers: It's Time to Stop Using Older Nodes and Move to 28nm
We tend to discuss leading-edge nodes and the most advanced chips made using them, but there are thousands of chip designs developed years ago that are made using what...
20 by Anton Shilov on 6/29/2022
As HPC Chip Sizes Grow, So Does the Need For 1kW+ Chip Cooling
One trend in the high performance computing (HPC) space that is becoming increasingly clear is that power consumption per chip and per rack unit is not going to stop...
40 by Anton Shilov on 6/27/2022
TSMC to Expand Capacity for Mature and Specialty Nodes by 50%
TSMC this afternoon has disclosed that it will expand its production capacity for mature and specialized nodes by about 50% by 2025. The plan includes building numerous new fabs...
13 by Anton Shilov on 6/16/2022
TSMC Unveils N2 Process Node: Nanosheet-based GAAFETs Bring Significant Benefits In 2025
At its 2022 Technology Symposium, TSMC formally unveiled its N2 (2 nm class) fabrication technology, which is slated to go into production some time in 2025 and will be...
24 by Anton Shilov on 6/16/2022
TSMC Readies Five 3nm Process Technologies, Adds FinFlex For Design Flexibility
Taiwan Semiconductor Manufacturing Co. on Thursday kicked off its 2022 TSMC Technology Symposium, where the company traditionally shares it process technology roadmaps as well as its future expansion plans...
44 by Anton Shilov on 6/16/2022
ASML High-NA Development Update: Coming to Fabs in 2024 - 2025
It took the semiconductor industry over a decade to prep everything needed for production of chips using extreme ultraviolet (EUV) lithography. It looks like it is going to take...
8 by Anton Shilov on 5/26/2022
Applied Materials Outlines Next-Gen Tools for 3nm and GAA Transistor Era
Last month Samsung Foundry quietly announced that it was set to begin producing chips using its 3GAE (3 nm-class, gate-all-around transistors, early) process technology in the second quarter. While...
17 by Anton Shilov on 5/12/2022
TSMC Roadmap Update: N3E in 2024, N2 in 2026, Major Changes Incoming
Taiwan Semiconductor Manufacturing Co. has solid plans for the next few years, but the foundry's manufacturing technology design cycles are getting longer. As a result, to address all of...
21 by Anton Shilov on 4/22/2022
AnandTech Interview with Dr. Ann Kelleher: EVP and GM of Intel’s Technology Development
It’s somewhat of an understatement to say that Intel’s future roadmap on its process node development is one of the most aggressive in the history of semiconductor design. The...
13 by Dr. Ian Cutress on 2/18/2022
A Visit to Intel’s D1X Fab: Next Generation EUV Process Nodes
On a recent trip to the US, I decided to spend some time criss-crossing the nation for a couple of industry events and spend some of the time visiting...
38 by Dr. Ian Cutress on 2/16/2022
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