Samsung
SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The initiative is designed to speed up the adoption of HBM4 memory and solidify SK hynix's and TSMC's leading positions in high-bandwidth memory and advanced processor applications. The primary focus of SK hynix's and TSMC's initial efforts will be to enhance the performance of the HBM4 stack's base die, which (if we put it very simply) acts like an ultra-wide interface between memory devices and host processors. With HBM4, SK hynix plans to use one of TSMC's advanced logic process technologies to build base dies to pack additional features and I/O pins within the confines of existing...
Samsung Foundry Outlines Roadmap Through 2027: 1.4 nm Node, 3x More Capacity
Samsung outlined its foundry business roadmap for the next five years at its Foundry Forum event last week. The company plans to introduce its next generation fabrication technologies in...
14 by Anton Shilov on 10/10/2022Samsung's $15 Billion R&D Complex to Overcome Limits of Semiconductor Scaling
Samsung on Friday broke ground for a new semiconductor research and development complex which will design new fabrication processes for memory and logic, as well as conduct fundamental research...
26 by Anton Shilov on 8/19/2022Samsung Portable SSD T7 Shield Review: Flagship PSSD Gets IP65 Avatar
Samsung's lineup of portable SSDs has enjoyed tremendous success, starting with the T1 back in 2015. The company has been regularly updating their PSSD lineup with the evolution of...
11 by Ganesh T S on 7/20/2022Samsung MUF-256DA USB-C Flash Drive Review: Thumb-Sized Performance Consistency
Portable SSDs have seen great demand over the last few years. Advancements in flash technology and controllers has resulted in compact drives delivering blistering speeds. These advancements have also...
20 by Ganesh T S on 7/6/2022Samsung Starts 3nm Production: The Gate-All-Around (GAAFET) Era Begins
Capping off a multi-year development process, Samsung’s foundry group sends word this morning that the company has officially kicked off production on its initial 3nm chip production line. Samsung’s...
22 by Ryan Smith on 6/30/2022Applied Materials Outlines Next-Gen Tools for 3nm and GAA Transistor Era
Last month Samsung Foundry quietly announced that it was set to begin producing chips using its 3GAE (3 nm-class, gate-all-around transistors, early) process technology in the second quarter. While...
17 by Anton Shilov on 5/12/2022DDR5 Demystified - Feat. Samsung DDR5-4800: A Look at Ranks, DPCs, and Do Manufacturers Matter?
The hottest advancement in memory technology for desktop computers in recent years is undoubtedly the release of DDR5 memory and Intel's 12th Gen Core series of processors. Not only...
68 by Gavin Bonshor on 4/7/2022Samsung Announces First PCIe 5.0 Enterprise SSD: PM1743, Coming In 2022
Even though CES 2022 is technically still a couple of weeks away, CES-related announcements are already starting to roll in. Among these are Samsung, who is announcing their first...
12 by Ryan Smith on 12/23/2021Semi CapEx to Hit $152 Billion in 2021 as Market on Track for $2 Trillion by 2035
Semiconductor makers have drastically increased their capital expenditures (CapEx) this year in response to unprecedented demand for chips that is going to last for years. Now the CEO of...
8 by Anton Shilov on 12/17/2021Texas To Get Multiple New Fabs as Samsung and TI to Spend $47 Billion on New Facilities
After a year of searching for the right place of its new U.S. fab, Samsung this week announced that it would build a fab near Taylor, Texas. The company...
135 by Anton Shilov on 11/24/2021Best Android Phones: November 2021
We’re nearing the end of the year and the holiday season, and all relevant devices for 2021 have seen their releases, and we’re entering a period of quiet before...
23 by Andrei Frumusanu on 11/19/2021Samsung Announces First LPDDR5X at 8.5Gbps
After the publication of the LPDDR5X memory standard earlier this summer, Samsung has now been the first vendor to announce new modules based on the new technology. The LPDDR5X standard...
19 by Andrei Frumusanu on 11/9/2021Samsung Foundry: 2nm Silicon in 2025
One of the key semiconductor technologies beyond 3D FinFET transistors are Gate-All-Around transistors, which show promise to help extend the ability to drive processors and components to higher performance...
29 by Dr. Ian Cutress on 10/6/2021Samsung Foundry’s New 17nm Node: 17LPV brings FinFET to 28nm
Despite most discussion about chip manufacturing focusing on the leading edge and blazingly fast and complex side of the industry, the demand for the ‘legacy’ process technologies is also...
11 by Dr. Ian Cutress on 10/6/2021Samsung Foundry to Almost Double Output by 2026
It’s hard not to notice that we’re in the middle of a semiconductor crunch right now. Factories are running at full steam, but pinch points in the supply chain...
6 by Dr. Ian Cutress on 10/6/2021Hot Chips 2021 Live Blog: New Tech (Infineon, EdgeQ, Samsung)
Welcome to Hot Chips! This is the annual conference all about the latest, greatest, and upcoming big silicon that gets us all excited. Stay tuned during Monday and Tuesday...
3 by Dr. Ian Cutress on 8/23/2021Samsung Teases 512 GB DDR5-7200 Modules
This week as part of the annual Hot Chips semiconductor conference, Samsung’s memory division has presented a poster/slides on a project it is currently working on with impressive end-point...
27 by Dr. Ian Cutress on 8/22/2021Samsung Unpacked 2021 Part 2: Galaxy Z Flip 3 & Z Fold 3 Announced
Today Samsung is holding its second Mobile Unpacked event for the year, announcing the new Galaxy Z Flip 3 and the new Galaxy Z Fold 3.
50 by Andrei Frumusanu on 8/11/2021Samsung: Deployment of 3nm GAE Node on Track for 2022
Samsung Foundry has made some changes to its plans concerning its 3 nm-class process technologies that use gate-all-around (GAA) transistors, or what Samsung calls its multi-bridge channel field-effect transistors...
32 by Anton Shilov on 7/9/2021Intel Hybrid CPU Starts 'End of Life' Process
As I opened my inbox this morning, I was surprised. I keep track of when Intel puts products on End of Life (or starts the process through something called...
58 by Dr. Ian Cutress on 7/7/2021