EUV
Although TSMC can't claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be the largest. As a result, the company has developed significant experience with EUV over the years, allowing TSMC to refine how they use EUV tooling to both improve productivity/uptime, and to cut down on the costs of using the ultra-fine tools. As part of the company's European Technology Symposium this week, they went into a bit more detail on their EUV usage history, and their progress on further integrating EUV into future process nodes. When TSMC started making chips using EUV lithography in 2019 on its N7+ process (for Huawei's HiSilicon), it held 42% of the...
GlobalFoundries Details 7 nm Plans: Three Generations, 700 mm², HVM in 2018
Keeping an eye on the ever-evolving world of silicon lithography, GlobalFoundries has recently disclosed additional details about its 7 nm generation of process technologies. As announced last September, the...
76 by Anton Shilov on 6/23/2017
Samsung and TSMC Roadmaps: 8 and 6 nm Added, Looking at 22ULP and 12FFC
Samsung and TSMC have made several important announcements about the present and future of their semiconductor manufacturing technologies in March. Samsung revealed that it had shipped over 70 thousand...
89 by Anton Shilov on 5/5/2017
GlobalFoundries to Expand Capacities, Build a Fab in China
GlobalFoundries has announced plans to expand manufacturing capacities for its leading edge and mainstream production technologies in the U.S., Germany and Singapore. After the upgrades of the fabs are...
49 by Anton Shilov on 2/11/2017
Intel to Equip Fab 42 for 7 nm
Intel this week announced plans to bring its Fab 42 online to produce semiconductors using a 7 nm fabrication process. It will take three to four years, and the...
24 by Anton Shilov on 2/9/2017
GlobalFoundries Updates Roadmap: 7 nm in 2H 2018, EUV Sooner Than Later?
GlobalFoundries recently announced the first details about its next generation 7 nm manufacturing technology, which is being developed in-house, and revealed plans to start production of chips using the...
76 by Anton Shilov on 10/3/2016
Intel’s ‘Tick-Tock’ Seemingly Dead, Becomes ‘Process-Architecture-Optimization’
As reported at The Motley Fool, Intel’s latest 10-K / annual report filing would seem to suggest that the ‘Tick-Tock’ strategy of introducing a new lithographic process note in...
98 by Ian Cutress on 3/22/2016
EUV Lithography Makes Good Progress, Still Not Ready for Prime Time
At the recent annual SPIE Advanced Lithography conference, Intel, TSMC and other leading semiconductor companies said that significant strides have been made in extreme ultraviolet lithography (EUVL) over the...
38 by Anton Shilov on 3/10/2016
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